Layout
Customized design and manufacturing. With/Without chamber layout kit, applicable for Seiko Epson and Hontech series test handler.
Socket
Customized design, various package such as BGA, QFN, QFP, POP etc., for different test stages such as Final Test, O/S, SLT, Brun-In on Bluetooth, CMOS, Memory and RF Testing.
Vacuum pad
Customized design according to package size with ESD coating protection, anti-adhesion.
Clean Pad
Customized design for various IC package, used for pogo pin cleanness to extend life time of pogo pin.
Pogo Pin
Standard and customized design. Various material type such as Pd alloy, Beryllium Copper, SK4 etc. Diameter down to 0.11 mm.
Customized Design
Product customized design consultancy, institutional improvement, customized jig design, customized testing equipment/tool/Jig design and manufacturing.
TIM(Thermal Interface Maerial)
Interface material between silicon and heat spreader/sink
Filling materials with high heat dissipation performance
Specializing in manufacturing process innovation, improving price competitiveness and user cost-effectiveness
